ITEM SPECIFICS
-
Brand
Model CPM-S1SSP
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origin
Republic of Korea
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Size(Capacity)
Handling capability : Strip 62~135 mm (W) X 50~280 mm (l), Unit, Wafer available
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Function
cu Post mounting, 2.5D & 3D Stack Packaging, SiP
PRODUCT DESCRIPTION
- System Performance
- Application : cu Post mounting, 2.5D & 3D Stack Packaging, SiP
Handling capability : Strip 62~135 mm (W) X 50~280 mm (l), Unit, Wafer available cu Post Position accuracy : ±25 ㎛
Min. Diameter of cu Post : Ø120 ㎛ aspect Ratio of cu Post : ≤ 5.0
Min. Pitch of cu Post : 250 ㎛ - Cu Post tilt angle : < 15 °
Imc Joint Strength : 3mPa
Imc thickness (Blt) : 5–25 ㎛
Warpage capability : max. 600 ㎛ for Substrate
Tooling conversion time : ≤ 20 minutes
PAYMENTS DETAILS
This supplier supports payments for offline orders
- Telegraphic Transfer : T/T
- Name : Lee,gyouho
SHIPPING
Shipping from :
Republic of Korea
- , 인천광역시,
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- Business Type :
- Manufacturer
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- Main Product :
-
- Established :
- 1996-01-01
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