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SSP

MPD-S1 Solder Paste Deposition System for 2.5D Packaging

  • Payment
    T/T
  • MOQ
    1 Set
  • Supply Ability
    10,000 Set per One-Time
  • Country of sale
    Asia, Americas, Europe, World Wide
  • PRICE
    • FOB

      Depend on quantity

ITEM SPECIFICS

  • Brand
    SSP
    Model MPD-S1
  • origin
    Republic of Korea
  • Size(Capacity)
    1450(l) × 1,200(W) × 2,070(H)
  • Function
    lED Display, flux Deposition, 2.5D&3D Stack Packaging, SiP


PRODUCT DESCRIPTION

System Performance

Application : lED Display, flux Deposition, 2.5D&3D Stack Packaging, SiP Handling capability  : Strip  62–135 mm (W) X 50–280 mm (l)
Cycle time / UPH         : 30,000 Dots in 12 sec–15 sec Deposition accuracy     : ± 25 ㎛ 
Min. Deposition Diameter : Ø60 ㎛ (for 01005 capacitor available) min. Deposition Pitch   : 125 ㎛
Min. Pad edge to component Distance : 100 ㎛ Paste Volume tolerance  : ± 10 %
Warpage capability      : max. 600 ㎛ for Substrate
Individual Pin force control : max. 3gf per Pin
Auto Pin tool cleaning  : Di Water / iPa (≤ 1 min)
Tooling conversion time : ≤ 20 minutes
Foot Print : 1450(l) × 1,200(W) × 2,070(H)

PAYMENTS DETAILS

This supplier supports payments for offline orders
  • Telegraphic Transfer : T/T
Contact Payment Manager
  • Name : Lee,gyouho

SHIPPING

Shipping from : Republic of Korea
  • , 인천광역시,
SSP
  • The person in charge

  • Address

    , 인천광역시,
  • Business Type :
    Manufacturer
  • Main Product :
  • Established :
    1996-01-01

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  • Response Level
      41% ~ 50%
  • Supplier Level
      Less than 100 million (KRW)
  • Transaction Level
      less than 5
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