Laser tech enables to locally heat the bonding area, which minimize the overall thermal exposure to sensitive devices. Also provide consistent STIM bond line thickness control.

Overview

This system is designed for high-power laser processing with a wide range of substrate and metal TIM materials. It supports large-area processing and precise BLT control, while providing real-time monitoring functions for stable and accurate operation.

Material: Substrate (Max. 300mm), Metal TIM (Reel type)

Laser: 2–20kW / 920–1080nm

Optic: 10 × 10mm ~ 300 × 300mm (depending on material size)

Loading: Tray / Boat

BLT Control: < ±10μm

Dimension: 1750 × 1680 × 2450mm (W × L × H)

Functions:

• Real-time temperature monitoring (IR Camera)

• Laser power monitoring & compensation (Power Sensor)

• Selective soldering (Option)

• Beam profile & size function (Option)