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wBPS-3000 wafer level Ball Placement System | SSP, Wafer level Ball Placement System, Ball Placement System, BPS
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full image wBPS-3000 wafer level Ball Placement System
SSP

wBPS-3000 wafer level Ball Placement System

  • Payment
    T/T
  • MOQ
    1 Set
  • Supply Ability
    10,000 Set per One-Time
  • Country of sale
    Asia, Americas, Europe, World Wide
  • Catalogue
  • PRICE

    • FOB

      Depend on quantity

ITEM SPECIFICS

  • Brand
    SSP
    Model wBPS-3000
  • origin
    Republic of Korea
  • Size(Capacity)
    N/A


PRODUCT DESCRIPTION

System Performance

high throughput : 40WPh(Based 12inch Si wafer 880,000balls)
Two stage concept” for Flux-Printing and Ball mounting
All kinds of Fo-WlP, WlcSP, Substrates
System alignment accuracy : ±10um
Finer Pitch capability : min 0.060mm Ball Diameter / min 0.120mm Ball Pitch

PAYMENTS DETAILS

This supplier supports payments for offline orders
  • Telegraphic Transfer : T/T
Contact Payment Manager
  • Name : Lee,gyouho

SHIPPING

Shipping from : Republic of Korea
  • , 인천광역시,
SSP

SSP

http://www.sspinc.co.kr Seller_Mail

  • The person in charge

  • Address

    , 인천광역시,
  • Business Type :
    Manufacturer
  • Main Product :
  • Established :
    1996-01-01

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COMPARISON TO SIMILAR ITEMS more

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SILVER SILVER
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  • Response Level
    ★ ★ ★ ★ ★   41% ~ 50%
  • Supplier Level
    ★ ★ ★ ★ ★   Less than 100 million (KRW)
  • Transaction Level
    ★ ★ ★ ★ ★   less than 5
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