BPS-Hybrid Ball Placement System for fine Ball & Pitch

Payment

T/T
MOQ

1 Set
Supply Ability

10,000 Set per One-Time
Country of sale

Asia, Americas, Europe, World Wide
Catalogue
PRICE
- FOB
  
  Depend on quantity

Description
Shipping&Payments
Company Introduction
POC SUGGESTIONS
(PROOF OF CONCEPT)
Product Reviews

ITEM SPECIFICS

Brand

SSP

Model BPS-Hybrid
origin

Republic of Korea
Size(Capacity)

Strip 50–95 mm (W) × 180–260 mm (l)
Function

Strip Handling SiP package

PRODUCT DESCRIPTION

System Performance

Application : Strip Handling SiP package
Handling capability : Strip 50–95 mm (W) × 180–260 mm (l) cycle time / UPH : 45 sec
Yield : 99.98%
Placement accuracy : ± 15 ㎛
min. Solder Ball Diameter : Ø60 ㎛
min. Pitch : 125 ㎛
Warpage capability : max. 10mm for Substrate

Rework : additional Rework m/c is Required

Tooling conversion time : ≤ 20 minutes

PATENT

˙ Ball grid array Solder Ball mount System
˙ Integrated circuit Package Solder Ball mount method and its following System

˙ Ball Supply System in terms of Ball Dispenser
˙ Inline System for marking and Ball mounting in terms of Semiconductor manufacturing Process
˙ Solder Ball mount Equipment Standard Value modi cation method and computer readable recording medium
˙ Solder Ball Bumping Unit and its covering Wafer Bumping Equipment and it using Bumping method
˙ Solder Ball Bumping Unit having assembly means and its covering Wafer Bumping Equipment and its using Bumping method