BPS-8200 Ball Placement System

Payment

T/T
MOQ

1 Set
Supply Ability

10,000 Set per One-Time
Country of sale

World Wide
Catalogue
PRICE
- FOB
  
  Depend on quantity

Description
Shipping&Payments
Company Introduction
POC SUGGESTIONS
(PROOF OF CONCEPT)
Product Reviews

ITEM SPECIFICS

Brand

SSP

Model BPS-8200
origin

Republic of Korea
Size(Capacity)

2,300(L)×1,350(W)×1,820(H)
Weight

3,000kg

PRODUCT DESCRIPTION

System Performance
Cycle time : 12–14 Sec (normal Package(1 Dotting/Strip))

25–30 Sec (fine Pitch Package(2 Dotting/Strip))

40–45 Sec (fine Pitch Package(2 Dotting/Half Strip))

Yield Performance : 99.98%
Placement accuracy : ± 0.02mm
Fine Pitch capability : 0.18 mm (for Ø0.10 mm)
Strip Handling capacity : 50–95 mm Width × 180–260 mm length Product flexibility : all kinds of laminated Substrate Bga Package series Quick conversion time : Ball tool, flux tool, lift Block
Foot Print & Weight : 2,300(l)×1,350(W)×1,820(H)
Foot Weight : 3,000 kg

BPS-8200 Process (Stand-alone type : Magazine input)

MOLD MARKING REFLOW -> SOLDER BALL -> ATTACH

PATENT

˙ Ball grid array Solder Ball mount System
˙ Integrated circuit Package Solder Ball mount method and its following System

˙ Ball Supply System in terms of Ball Dispenser
˙ Inline System for marking and Ball mounting in terms of Semiconductor manufacturing Process
˙ Solder Ball mount Equipment Standard Value modi cation method and computer readable recording medium
˙ Solder Ball Bumping Unit and its covering Wafer Bumping Equipment and it using Bumping method
˙ Solder Ball Bumping Unit having assembly means and its covering Wafer Bumping Equipment and its using Bumping method